Accelerate Chip Design with High Performance Engineering Workflows

Oakwood enables semiconductor and EDA teams to run faster simulations, optimize compute environments, and scale securely with Azure HPC.

Trusted by industry leaders

Microsoft
Applied Materials
onsemi
Duke University
Microsoft
Applied Materials
onsemi
Duke University
Microsoft
Applied Materials
onsemi
Duke University

INDUSTRY CHALLENGES

Electronic Design Automation (EDA)

Semiconductor and EDA organizations are under pressure to shorten design cycles, manage rising computational demands and protect valuable intellectual property.

Compute bottlenecks slow design cycles
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Compute bottlenecks slow design cycles

Growing model complexity demands more scalable infrastructure.

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Fragmented engineering environments

Tools, workflows, and data pipelines are often disjointed.

Fragmented engineering environments
Intellectual property risks
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Intellectual property risks

Highly sensitive design assets require strong, multi-layered security.

SEMICONDUCTOR INNOVATION

How Oakwood accelerates semiconductor innovation

Modernizing HPC environments, streamlining engineering workflows, and enhancing data insight to help semiconductor teams innovate at speed and scale.

Modernize and scale hpc environments

Oakwood builds and optimizes HPC environments using Azure and hybrid infrastructure.

Streamline engineering workflows

Oakwood integrates simulation tools, data systems, and pipelines.

Enhance data and telemetry insight

Oakwood provides visibility into performance, cost, and utilization for engineering workloads.

Protect high value IP and design assets

Oakwood deploys Microsoft security tools tailored to engineering and semiconductor firms.

FEATURED CASE STUDY
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microsoft csp webinar

Accelerate complex design workflows

Power faster simulations, reduce bottlenecks, and optimize compute performance on Azure.